Wire bonding in microelectronics naterials, orocesses, reliability and yield
Wire bonding in microelectronics materials, processes, reliability, andyield
| Main Author: | HARMAN, George |
|---|---|
| Format: | Buku Teks |
| Language: | Bahasa Inggris |
| Published: |
McGraw - Hill Book Company
1997
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| Online Access: |
http://oaipmh-jogjalib.umy.ac.idkatalog.php?opo=lihatDetilKatalog&id=23357 |
| Summary: |
Wire bonding in microelectronics materials, processes, reliability, andyield |
|---|---|
| Physical Description: |
xiii, 290 p. ,24 cm 16 cm 0 cm |
| ISBN: |
ISBN:0-07-032619-3 |